Rockwell Automation Unveils Virtual Cookie Production at Interpack 2026

At Interpack 2026 in Dusseldorf, Germany, Rockwell Automation showcased a collaborative multi-vendor ecosystem. This setup emphasized an end-to-end virtual cookie production line, demonstrating the integration of digital twins, AI, and connected data architectures in food manufacturing. These technologies allow manufacturers to enhance the design, integration, and optimization of operations.

The demonstration, which featured a fully virtualized cookie production and packaging line, aimed to show improved performance through digital connectivity. The process includes dough preparation, baking, cooling, and packaging phases, utilizing systems from leading OEMs like Royal Kaak, GEA, and Mespack. The use of Emulate3D™ digital twin software and iTRAK® systems plays a critical role in fault reduction and process optimization.

Visitors at the event could explore the benefits of unified and scalable data architectures in creating efficient production environments. Combining OEM machines and engineering data, Rockwell's technologies promote risk reduction and operational effectiveness.