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Manz Asia Unveils Pioneering 310mm × 310mm ECD System
Manz Asia, a leader in semiconductor packaging equipment, has launched the world's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system. This advancement marks a significant expansion in their product line, showcasing expertise in process innovation and high-volume manufacturing.
The 310mm × 310mm ECD platform offers high flexibility, supporting both glass and metal carriers. It integrates wet chemical processes for advanced packaging architectures such as FOPLP, CoPoS, and TGV. This technology supports AI, high-performance computing (HPC), and high-speed memory applications.
With the Omni x-series, including platforms of 510mm and 700mm, Manz Asia provides a scalable solution for mass production. Robert Lin, CEO, highlights the growing demand for flexible packaging platforms in AI and HPC markets. The company aims to further enhance manufacturing efficiency, adapting to evolving semiconductor needs.
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