LPKF Strengthens Semiconductor Advancements with Strategic Technology Delivery

On October 28, 2025, LPKF Laser & Electronics SE announced its contribution of strategic technology to the Fraunhofer Institute's Glass Panel Technology Group (GPTG). This initiative aims to revolutionize semiconductor packaging using glass substrates. The GPTG, officially launched on October 1, 2025, in Berlin, consists of 15 major companies across the value chain, including material suppliers, manufacturers, and system integrators.

LPKF's unique Laser Induced Deep Etching (LIDE) technology will play a pivotal role in creating Through Glass Vias (TGVs) and Redistribution Layers (RDL) for high-precision large glass panels. This technology is vital for the consortium's mission to standardize processes and optimize glass substrates for mass production, particularly in next-generation computing and AI applications.

This collaboration cements LPKF's leading position in advancing electronics packaging, focusing on glass substrates as a key material to meet the demands for advanced packaging architectures. The initiative is set to enhance technological progress and fortify the competitive edge of the participating companies.