Acceleronix and IDEMIA Unveil IFPP Early Access Program at MWC26

Acceleronix and IDEMIA Secure Transactions have launched the In-Factory Profile Provisioning (IFPP) Early Access Program at MWC Barcelona 2026 in collaboration with Tele2 IoT. The initiative provides early access to a quantum-safe IFPP solution tailored for IoT devices, allowing OEMs to preload connectivity profiles onto eSIMs during manufacturing using a single eSIM part number.

The live demonstrations at the event highlight how devices can be factory-ready for immediate connectivity, enhancing the IoT lifecycle and expediting global scalability. This program integrates Acceleronix’s platform with IDEMIA’s IFPP-ready eSIM IoT and Tele2 IoT's global connectivity capabilities. Notable benefits include automated provisioning, real-time monitoring, and enhanced security, aligning with future GSMA specifications.

Acceleronix Director Gal Olshinka emphasized the commitment to eSIM technology and its role in streamlining IoT processes. Philippe De Oliveira from IDEMIA highlighted the significant optimization benefits for OEMs, while Onur Kasaba of Tele2 IoT noted the reduction in operational complexity through this collaboration.